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Device: S71VS256RC0ZHK24 [FBGA56]

Manufacturer: Spansion

Part number description for this device:

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S Spansion Memory  
XX Product Series 71 = Multi-chip product (MCP)73 = Stacked products (MCP)98 = Stacked Multi-chip product
X Flash Interface And Simultaneous Read-Write J = Standard, simultaneous read-writeA = Standard, no simultaneous read-writeP = Page, simultaneous read-writeG = Page, no simultaneous read-writeW = Burst (Demux add/data), simultaneous read-writeR = Burst (Demux add/data), no simultaneous read-writeN = Burst (Mux add/data), simultaneous read-writeK = Burst (Mux add/data), no simultaneous read-writeC = Automotive burst (Demux), simultaneous read-writeV = Simultaneous Read/Write, Burst mode with multiplexed I/OX = Address-high, address-low, data multiplexed
X Core Voltage F = 5.0 V VccL = 3.0 V VccD = 2.5 V VccS = 1.8V Vcc
XXX Density 001-999 = 1Mb - 999Mb01G-64G = 1Gb - 64Gb
X Process Technology B = 320 nm, Floating gate technologyC = 320 nm, Floating gate technologyD = 200 nm, Floating gate technologyG = 170 nm, Floating gate technologyH = 130 nm, Floating gate technologyJ = 110 nm, Floating gate technologyM = 230 nm, MirrorBit technologyA = 200 nm MirrorBit technologyN = 110 nm, MirrorBit technologyP = 90 nm, MirrorBit technologyK = 90 nm, Floating gate technologyR = 65 nm, MirrorBit technology
X pSRAM Density C = 64Mb
X Chip Contents 0No content (default)
XX Package Type ZH = Very thin fine-pitch ball grid array (VFBGA)
X Package Modifier K = 7.7 x 6.2, 56-ball BGA, 0.5mm ball pitch (0.3mm ball diameter)E = 9.2 x 8.0, 56-ball BGA, 0.5mm ball pitch (0.3mm ball diameter)
XX Model Number  
X Packing Type 0Tray2 = 7-inch Tape and Reel3 = 13-inch Tape and Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605)
BeeHive204AP adapter/module: AP1 BGA56-1.1 NOR-1 (71-3267)
BeeHive208S adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605)
BeeHive304 adapter/module: AP3 BGA56-1.1 NOR-1 (73-6286)
BeeProg2 adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605)
BeeProg2AP adapter/module: AP1 BGA56-1.1 NOR-1 (71-3267)
BeeProg2C adapter/module: BGA-0401/0605 (70-0401/0605) = BGA-Bottom-14 (70-0401) + BGA-Top-95 ZIF-CS (70-0605)
BeeProg3 adapter/module: AP3 BGA56-1.1 NOR-1 (73-6286)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA56-1.1 NOR-1 (71-3267)
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